BE Semiconductor Industries N.V. Develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide. The company's principal products include the attach equipment, such as single chips, multi chips, multi modules, flip chips, TCB and eWLB bonding systems, and the sorting systems; conventional packaging, ultra thin and wafer level molding, as well as trim and molding, and singulation systems. Its principal products also include plating equipment of tin, copper, and precious metal plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company mainly supplies chip manufacturers, assembly subcontractors, and electronics and industrial companies. BE Semiconductor Industries N.V. was founded in 1995 and is headquartered in Duiven, the Netherlands.
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