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BE Semiconductor Industries Value Stock - Dividend - Research Selection

Be semiconductor industries

ISIN: US0733201034 , WKN: 898494

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Description of the company

BE Semiconductor Industries N.V. develops, manufactures, markets, sells, and services semiconductor assembly equipment for the semiconductor and electronics industries worldwide. The company\'s principal products include die attach equipment, such as single chips, multi chips, multi modules, flip chips, TCB and eWLB die bonding systems, and die sorting systems; and packaging equipment comprising conventional, ultra thin, and wafer level molding, as well as trim and form, and singulation systems. Its principal products also comprise plating equipment consisting of tin, copper, and precious metal plating systems, as well as related process chemicals; and tooling, conversion kits, spare parts, and other services. The company provides its products primarily to chip manufacturers, assembly subcontractors, and electronics and industrial companies. BE Semiconductor Industries N.V. was founded in 1995 and is headquartered in Duiven, the Netherlands.

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NEWS


BE Semiconductor Industries N.V. (BESIY) Analyst/Investor Day - Slideshow

2026-06-19
2026-06-19. The following slide deck was published by BE Semiconductor Industries N.V.

BE Semiconductor Industries N.V. (BESIY) Analyst/Investor Day Transcript

2026-06-18

Ultra Clean (UCTT) Surges 6.5%: Is This an Indication of Further Gains?

2026-06-03
Ultra Clean (UCTT) saw its shares surge in the last session with trading volume being higher than average. The latest trend in earnings estimate revisions may not translate into further price increase in the near term.

European Stocks Tracking Lower in Friday Trading; Lack of US-China Trade Deal Hits Tech Shares

2026-05-15
The European stock markets were tracking lower in Friday trading as investors parse the results - or

Assessing BE Semiconductor Industries (ENXTAM:BESI) Valuation After A Powerful Share Price Rally

2026-04-25
BE Semiconductor Industries (ENXTAM:BESI) has drawn investor attention after a strong run in recent months, prompting closer scrutiny of its share price, business mix and recent financial metrics. See our latest analysis for BE Semiconductor Industries. The recent 1-month share price return of 35.96% and 90-day share price return of 44.07% suggest strong momentum building, echoed by a 1-year total shareholder return of 159.89% and 5-year total shareholder return of 339.95%. If strong...

BE Semiconductor Industries N.V. (BESIY) Q1 2026 Earnings Call Transcript

2026-04-24
BE Semiconductor Industries N.V. (BESIY) Q1 2026 Earnings Call April 23, 2026 10:00 AM EDTCompany ParticipantsRichard Blickman - Chairman of Management...

BE Semiconductor Industries N.V. 2026 Q1 - Results - Earnings Call Presentation

2026-04-24
2026-04-24. The following slide deck was published by BE Semiconductor Industries N.V.

BE Semiconductor Industries NV (BESIY) Q1 2026 Earnings Call Highlights: Record Growth in ...

2026-04-24
BE Semiconductor Industries NV (BESIY) reports a robust first quarter with significant increases in revenue, net income, and orders, while anticipating continued growth in the upcoming quarter.

BE Semiconductor Industries N.V. Announces Q1-26 Results

2026-04-23
Q1-26 Orders of € 269.7 Million Up 104.5% vs. Q1-25 Revenue of € 184.9 Million and Net Income of € 51.6 Million Up 28.3% and 63.8%, Respectively, vs. Q1-25 DUIVEN, the Netherlands, April 23, 2026 (GLOBE NEWSWIRE) -- BE Semiconductor Industries N.V. (the “Company" or "Besi") (Euronext Amsterdam: BESI; OTC markets: BESIY), a leading manufacturer of assembly equipment for the semiconductor industry, today announced its results for the first quarter ended March 31, 2026. Key Highlights Revenue of €

Besi posts higher bookings in first-quarter, as AI boosts demand for hybrid bonding tech

2026-04-23
BE Semiconductor Industries (BESI) on Thursday reported quarterly orders above last year's level, ‌reflecting growth across all its markets and ‌particularly strong demand for hybrid bonding. Investors are banking on growing ​orders for Besi's hybrid bonding solutions, a chip technology allowing two chips to be bonded directly on top of each other, citing its first-mover advantage ‌amid a surge ⁠in demand for AI-enabling technology. Besi said its order bookings, an important indicator of ⁠future growth, jumped 104.5% to 269.7 million euros ($315.5 million) in the first quarter, compared with 131.9 million ​euros last ​year.