BE Semiconductor Industries Value Stock - Dividend - Research Selection
BE Semiconductor Industries
ISIN: US0733201034, WKN: 898494
Market price: 84,10 USD
BE Semiconductor Industries Fundamental data and company key figures of the share
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| Key figures | 07-04-2021 | ||||||||||||||||||||||||||||||||||||||||||||||||
| Cash flow | |||||||||||||||||||||||||||||||||||||||||||||||||
| Net operating cash flow | 162.021.000 | ||||||||||||||||||||||||||||||||||||||||||||||||
| Capital Expenditures | -21.863.000 | ||||||||||||||||||||||||||||||||||||||||||||||||
| Free cash flow | 140.158.000 | ||||||||||||||||||||||||||||||||||||||||||||||||
| Balance sheet | |||||||||||||||||||||||||||||||||||||||||||||||||
| Total Equity | 371.227.000 | ||||||||||||||||||||||||||||||||||||||||||||||||
| Liabilities & Shareholders equity | 911.356.000 | ||||||||||||||||||||||||||||||||||||||||||||||||
| Income statement | |||||||||||||||||||||||||||||||||||||||||||||||||
| Net income | 132.275.000 | ||||||||||||||||||||||||||||||||||||||||||||||||
| Eps (diluted) | 1,900 | ||||||||||||||||||||||||||||||||||||||||||||||||
| Diluted shares outstanding | 72.865.900 | ||||||||||||||||||||||||||||||||||||||||||||||||
| Net sales/revenue | 433.623.000 | ||||||||||||||||||||||||||||||||||||||||||||||||
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| Description | Data |
|---|---|
| Symbol | BESIY |
| Market Capitalization | 6.128.022.016,00 USD |
| Country | United States |
| Indices | NO INDEX |
| Sectors | Semiconductor Equipment |
| Raw Data Source | IFRS in Millionen USD |
| Stock Split | 2018-05-11,2.0000/1.0000; 2018-05-10,2.0000/1.0000 |
| Internet | www.besi.com |
Description of the company
BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the semiconductor and electronics industries. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. It offers products, including Die attach equipment, which include single chip, multi chip, multi module and flip chip; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals. It also offers services, such as tooling, conversion kits, spare parts and other services to its customer installed base. It also offers wire bonding equipment. Its principal operations are in the Netherlands, Austria, Switzerland, Malaysia and China.