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MACOM Technology Solutions Holdings Value Stock - Dividend - Research Selection

Macom

ISIN: US55405Y1001 , WKN: A1JU1D

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Description of the company

MACOM Technology Solutions Holdings, Inc., together with its subsidiaries, designs and manufactures analog radio frequency (RF), microwave, millimeterwave, and photonic semiconductor solutions in the United States, the Asia Pacific, and internationally. The company offers a portfolio of standard and custom devices, which include integrated circuits, multi-chip modules, power pallets and transistors, diodes, amplifiers, switches and switch limiters, passive and active components, and complete subsystems for more than 60 product lines. Its semiconductor products are electronic components that are incorporated in electronic systems, such as point-to-point wireless backhaul radios, high density networks, active antenna arrays, radars, magnetic resonance imaging systems, and unmanned aerial vehicles. The company serves various markets, such as networks, which includes carrier and enterprise infrastructure, wired broadband and cellular backhaul, cellular infrastructure, photonic solutions, and fiber optic applications; aerospace and defense comprising military and commercial radar, RF jammers, electronic countermeasures, and communication data links; and multi-market that consist of industrial, medical, test and measurement, and scientific applications. It sells its products through direct sales force, applications engineering staff, independent sales representatives, resellers, and distributors, as well as an e-commerce channel. MACOM Technology Solutions Holdings, Inc. was incorporated in 2009 and is headquartered in Lowell, Massachusetts.

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NEWS


MACOM Introduces 3.2T Chipset Solution for High Speed Optical Connectivity

2026-09-17
LOWELL, Mass., Sept. 17, 2026 (GLOBE NEWSWIRE) -- MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, today announced a front end chipset solution for 3.2T applications, designed to accelerate the development of next generation optical interconnects for AI infrastructure, cloud data centers and high speed networking applications. The solution is designed to support new optical architectures, delivering up to 3.2T throughput through eight channels operating at

MACOM Demonstrates Technologies Enabling the Future of High Speed Connectivity at ECOC 2026

2026-09-15
LOWELL, Mass., Sept. 15, 2026 (GLOBE NEWSWIRE) -- MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, today announced it will showcase its latest optical and high speed connectivity technologies at the European Conference on Optical Communication (ECOC) 2026, taking place September 21 - 23, 2026, in Málaga, Spain. Visitors to Stand 1055 can learn about MACOM’s broad portfolio of solutions designed to support the growing bandwidth, performance and power effici

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