Amkor Aktie - Fundamentalanalyse - Dividendenrendite KGV

Amkor Technology (ISIN: US0316521006, WKN: 911648) Kursdatum: 22.06.2018 Kurs: 8,930 USD
Beschreibung Daten
Symbol AMKR
Marktkapitalisierung 2.140.083.456,00 USD
Land Vereinigte Staaten von Amerika
Indizes NASDAQ Comp.
Sektor Technology
Rohdaten nach US GAAP in Millionen USD
Aktiensplits
Internet www.amkor.com
Letztes Bilanz Update 23.02.2018

Fundamentaldaten

Fundamental Verhältnisse errechnet am: 22.06.2018
KFCV KCV DIV Rendite GKR EKQ KGV KUV KBV
31,79 3,46 0,00% 5,78 36,88 8,19 0,51 1,28

Firmenbeschreibung

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States and internationally. The company offers turnkey packaging and test services, including semiconductor wafer bumps, wafer probes, wafer back-grinds, package design, packaging, and test and drop shipment services. Its packages employ wirebond, flip chip, and copper clip and other interconnect technologies. The company also provides semiconductor testing services, such as wafer testing or probe, and final test services; flip chip scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory, and as applications processors in mobile devices; and flip chip ball grid array products for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages used in power management, transceivers, sensors, wireless charging, codecs, and specialty silicon; Wafer-level fan-out packages used in ICs; and silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure. Further, the company provides leadframe packages that are used in electronic devices for low to medium pin count applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electro-mechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, baseband processing, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

Die Finanzoo GmbH übernimmt keine Haftung für die Richtigkeit der Angaben! Alle Angaben sind ohne Gewähr. Quellen: www.bundesanzeiger.de, www.sec.gov, www.amkor.com